BESIII ETOF upgrade readout electronics commissioning

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Xiao-Zhuang Wang, Hong-Liang Dai, Zhi Wu, Yue-Kun Heng, Jie Zhang, Ping Cao, Xiao-Lu Ji, Cheng Li, Wei-Jia Sun, Si-Yu Wang and Yun Wang. BESIII ETOF upgrade readout electronics commissioning[J]. Chinese Physics C, 2017, 41(1): 016103. doi: 10.1088/1674-1137/41/1/016103
Xiao-Zhuang Wang, Hong-Liang Dai, Zhi Wu, Yue-Kun Heng, Jie Zhang, Ping Cao, Xiao-Lu Ji, Cheng Li, Wei-Jia Sun, Si-Yu Wang and Yun Wang. BESIII ETOF upgrade readout electronics commissioning[J]. Chinese Physics C, 2017, 41(1): 016103.  doi: 10.1088/1674-1137/41/1/016103 shu
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Received: 2016-03-10
Revised: 2016-05-10
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    Supported by Chinese Academy of Sciences (1G201331231172010)

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BESIII ETOF upgrade readout electronics commissioning

    Corresponding author: Hong-Liang Dai,
    Corresponding author: Zhi Wu,
    Corresponding author: Yue-Kun Heng,
  • 1. Department of Modern Physics, University of Science and Technology of China, Hefei 230026, China
  • 2. State Key Laboratory of Particle Detection and Electronics, Beijing 100049, China
  • 3. Institute of High Energy Physics, Chinese Academy of Sciences, Beijing 100049, China
  • 4. State Key Laboratory of Particle Detection and Electronics, Beijing 100049, China
  • 5. Institute of High Energy Physics, Chinese Academy of Sciences, Beijing 100049, China
Fund Project:  Supported by Chinese Academy of Sciences (1G201331231172010)

Abstract: It is proposed to upgrade the endcap time-of-flight (ETOF) of the Beijing Spectrometer III (BESIII) with a multi-gap resistive plate chamber (MRPC), aiming at an overall time resolution of about 80 ps. After completing the entire readout electronics system, some experiments, such as heat radiation, radiation hardness and large-current beam tests, have been carried out to confirm the reliability and stability of the readout electronics. An on-detector test of the readout electronics has also been performed with the beam at the BEPCII E3 line. The test results indicate that the readout electronics system fulfills its design requirements.

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