Thermal stability and separation characteristics of anti-sticking layers of Pt/Cr films for the hot slumping technique

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Shuang Ma, Ming-Wu Wen and Zhan-Shan Wang. Thermal stability and separation characteristics of anti-sticking layers of Pt/Cr films for the hot slumping technique[J]. Chinese Physics C, 2016, 40(7): 079001. doi: 10.1088/1674-1137/40/7/079001
Shuang Ma, Ming-Wu Wen and Zhan-Shan Wang. Thermal stability and separation characteristics of anti-sticking layers of Pt/Cr films for the hot slumping technique[J]. Chinese Physics C, 2016, 40(7): 079001.  doi: 10.1088/1674-1137/40/7/079001 shu
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Received: 2015-09-30
Revised: 2015-02-06
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    Supported by CAS XTP project XDA04060605

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Thermal stability and separation characteristics of anti-sticking layers of Pt/Cr films for the hot slumping technique

    Corresponding author: Zhan-Shan Wang,
  • 1. MOE Key Laboratory of Advanced Micro-Structured Materials, Institute of Precision Optical Engineering, School of Physics Science and Engineering, Tongji University, Shanghai 200092, China
Fund Project:  Supported by CAS XTP project XDA04060605

Abstract: The thermal stability and separation characteristics of anti-sticking layers of Pt/Cr films are studied in this paper. Several types of adhesion layers were investigated:10.0 nm Pt, 1.5 nm Cr+50.0 nm Pt, 2.5 nm Cr+50.0 nm Pt and 3.5 nm Cr+50.0 nm Pt fabricated using direct current magnetron sputtering. The variation of layer thickness, roughness, crystallization and surface topography of Pt/Cr films were analyzed by grazing incidence X-ray reflectometry, large angle X-ray diffraction and optical profiler before and after heating. 2.5 nm Cr+50.0 nm Pt film exhibits the best thermal stability and separation characteristics according to the heating and hot slumping experiments. The film was also applied as an anti-sticking layer to optimize the maximum temperature of the hot slumping technique.

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