Thermal stability and separation characteristics of anti-sticking layers of Pt/Cr films for the hot slumping technique

Shuang Ma; Ming-Wu Wen; Zhan-Shan Wang

doi:10.1088/1674-1137/40/7/079001

Chinese Physics C> 2016, Vol. 40> Issue(7) : 079001 DOI: 10.1088/1674-1137/40/7/079001

Thermal stability and separation characteristics of anti-sticking layers of Pt/Cr films for the hot slumping technique

1.
MOE Key Laboratory of Advanced Micro-Structured Materials, Institute of Precision Optical Engineering, School of Physics Science and Engineering, Tongji University, Shanghai 200092, China

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Abstract：
The thermal stability and separation characteristics of anti-sticking layers of Pt/Cr films are studied in this paper. Several types of adhesion layers were investigated:10.0 nm Pt, 1.5 nm Cr+50.0 nm Pt, 2.5 nm Cr+50.0 nm Pt and 3.5 nm Cr+50.0 nm Pt fabricated using direct current magnetron sputtering. The variation of layer thickness, roughness, crystallization and surface topography of Pt/Cr films were analyzed by grazing incidence X-ray reflectometry, large angle X-ray diffraction and optical profiler before and after heating. 2.5 nm Cr+50.0 nm Pt film exhibits the best thermal stability and separation characteristics according to the heating and hot slumping experiments. The film was also applied as an anti-sticking layer to optimize the maximum temperature of the hot slumping technique.
- hot slumping technique ,
- anti-sticking layers ,
- Pt/Cr film ,
- thermal stability ,
- separation characteristic

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Shuang Ma, Ming-Wu Wen and Zhan-Shan Wang. Thermal stability and separation characteristics of anti-sticking layers of Pt/Cr films for the hot slumping technique[J]. Chinese Physics C, 2016, 40(7): 079001. doi: 10.1088/1674-1137/40/7/079001

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Received: 2015-09-30
Revised: 2015-02-06

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Supported by CAS XTP project XDA04060605

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通讯作者: 陈斌, bchen63@163.com

1.
沈阳化工大学材料科学与工程学院沈阳 110142

Thermal stability and separation characteristics of anti-sticking layers of Pt/Cr films for the hot slumping technique

Corresponding author: Zhan-Shan Wang,

1. MOE Key Laboratory of Advanced Micro-Structured Materials, Institute of Precision Optical Engineering, School of Physics Science and Engineering, Tongji University, Shanghai 200092, China

Received Date: 2015-09-30

Accepted Date: 2015-02-06

Available Online: 2016-07-05

Fund Project: Supported by CAS XTP project XDA04060605

Abstract: The thermal stability and separation characteristics of anti-sticking layers of Pt/Cr films are studied in this paper. Several types of adhesion layers were investigated:10.0 nm Pt, 1.5 nm Cr+50.0 nm Pt, 2.5 nm Cr+50.0 nm Pt and 3.5 nm Cr+50.0 nm Pt fabricated using direct current magnetron sputtering. The variation of layer thickness, roughness, crystallization and surface topography of Pt/Cr films were analyzed by grazing incidence X-ray reflectometry, large angle X-ray diffraction and optical profiler before and after heating. 2.5 nm Cr+50.0 nm Pt film exhibits the best thermal stability and separation characteristics according to the heating and hot slumping experiments. The film was also applied as an anti-sticking layer to optimize the maximum temperature of the hot slumping technique.

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Thermal stability and separation characteristics of anti-sticking layers of Pt/Cr films for the hot slumping technique

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